Field Application Engineer

We are hiring a Field Application Engineer for our client based in San Jose, CA.

Join an exceptionally well-funded semiconductor innovator transforming power management for next-generation AI processors and GPUs. Backed by $26M in total funding (including a recent $21M Series A backed by premier deep-tech VC's and Intel Capital), we have developed a silicon-proven, hybrid switched-capacitor (HSC) architecture that eliminates traditional data center thermal and size bottlenecks. We are seeking a hands-on, customer-facing FAE to drive system board bring-ups and layout reviews directly in our hyperscale customers' labs.

Key Responsibilities

• Customer Lab Support: Spend significant time in customer labs providing hands-on support for system board bring-up, debugging, and hardware validation
• Design & Review: Conduct deep customer design support, including thorough schematic and PCB layout reviews
• Requirement Translation: Interface directly with customer power and platform engineers to study xPU power requirements and draft technical proposals
• Simulation & Analysis: Run SIMPLIS simulations to evaluate efficiency and transient response against target specifications
• Cross-Functional Collaboration: Partner internally with power module engineers, thermal specialists, and IC designers to deliver optimized solutions.

Required Skills & Knowledge

• Experience: 4–7 years of power hardware engineering experience with strong customer-facing skills (Applications or Field Applications Engineering preferred
• Component Mastery: Direct experience working with digital PWM controllers, DrMOS, Smart Power Stages (SPS), or high-density power modules
• Power Electronics Foundation: Solid understanding of DC power distribution, VRMs, and topologies (e.g., multiphase Buck, LLC, or switched-capacitor
• Data Center Scale: Understanding of modern in-server power architectures (48V or 400V/800V) and high-power solutions (1kW and above)
• Simulation Tools: Hands-on proficiency with SIMPLIS to analyze hardware efficiency and transient behavior.
• Thermals & Standards: High-level understanding of advanced cooling solutions and alignment with industry standards (e.g., OCP).