The Director of Yield & Integration is accountable for wafer yield, device performance, process integration, and disciplined process transfer, including volume production ramp, for the EFK manufacturing site. This role owns end‑to‑end yield outcomes and transfer execution to ensure predictable output, competitive cost, and sustainable quality in a 24x7 manufacturing environment.
A core responsibility of this role is establishing and enforcing standardized process transfer practices that enable consistent replication of technologies and best practices from other sites, while embedding a strong First Time Right quality mindset across the fab.
This leader builds and leads the Yield, Integration, Defect Reduction, and Device organization and serves as a key technical and quality authority on the EFK leadership team
Yield, Device, and Parametric Performance
- Own site wafer yield, device performance, and electrical/parametric health.
- Define yield targets and release criteria aligned with cost, output, and customer commitments.
- Own electrical and parametric performance governance, including disposition strategy, Cpk, detection effectiveness, and yield release decisions.
- Establish and maintain yield dashboards, leading indicators, and executive‑level reporting.
- Act as final technical decision authority during high‑impact yield excursions and time‑critical manufacturing events.
- Partner with probe engineering, product engineering, and assembly & final test to ensure robust test coverage and to drive end-to-end yield improvements.
Process Integration
- Own process integration across technologies, ensuring stable interactions, adequate margin, and manufacturability.
- Ensure strong alignment between device intent, process capability, and manufacturing execution.
- Drive cross‑module optimization to reduce variation, complexity, and yield loss.
- Ensure integration readiness for tool, material, and process changes.
Process Transfer & Copy Discipline
- Own the end‑to‑end process transfer framework for technologies and best practices transferred into EFK.
- Establish, document, and enforce a clear process transfer methodology, including:
- Transfer readiness and baseline definition
- Documentation and control requirements
- Validation approach, learning cycles, and release‑to‑manufacturing criteria
- Ensure transferred processes are implemented with high fidelity and clear intent while accounting for EFK‑specific constraints.
- Prevent uncontrolled divergence, reliance on tribal knowledge, and informal customization during transfer and ramp.
- Capture and institutionalize lessons learned into site standards and playbooks.
- Lead cross‑site technical collaboration with source fabs and corporate technology teams.
Defect Inspection
- Own test wafer and product defect inspection for fab controls and yield improvement.
- Continuously improve and build out automated defect classification systems for improved productivity and faster mean time to detect.
- Drive fabwide defect reduction strategy.
Failure Analysis & Offline Electrical Bench Testing Labs
- Oversee operation and maintenance of wafer-level failure analysis labs including SEM, FIB, TEM, SRP, AFM and associate sample preparation
- Support root cause analyses, technology development, yield improvement, and fab tool matching
- Own offline electrical bench testing for yield and quality improvement
- Own offline VPD – mass spectroscopy for ultra-trace metallic contamination monitoring
Quality Leadership & First Time Right
- Serve as a primary steward of the site’s First Time Right quality culture.
- Embed prevention‑focused thinking into yield, integration, device, and manufacturing decisions.
- Lead structured response to yield, integration, and device excursions, including containment, root cause, and permanent corrective action.
- Ensure yield improvements are sustainable and do not introduce long‑term reliability or manufacturability risk.
- Reinforce ownership, accountability, and escalation discipline across the site.
Cost, Productivity, and Roadmap Alignment
- Drive yield‑related cost improvements through scrap reduction, rework elimination, and accelerated learning.
- Support stable cycle time through strong integration execution and process control.
- Align integration and device priorities with site and business technology roadmaps.
Organization & Talent Development
- Build and lead a high‑performing Yield, Integration, and Device organization.
- Develop technical leaders and future managers; own succession planning and bench strength.
- Set expectations for data‑driven decision‑making, technical ownership, and disciplined follow‑through.
- Foster a culture of accountability, collaboration, and continuous improvement.
