Position Overview
We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies.
This role serves as the primary technical and program interface between Rapidus and customers, integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.
You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional coordination skills to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.
About Rapidus
Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.
Key Responsibilities
Customer Design Integration & Enablement
- Lead customer design bring-up using Rapidus Assembly Design Kits (ADKs)
- Guide customers in effectively applying:
- Package design rules, libraries, and interface definitions
- Interposer and substrate architectures
- SI/PI/thermal design methodologies
- Provide technical guidance on chiplet integration, including HBM, UCIe, PCIe, and high-speed SerDes
Program Execution & Delivery Ownership
- Drive customer projects toward successful 2.5D/3D package design tape-out and product realization:
- Manage:
- Design schedules and milestones
- Risks, issues, and dependencies
- Cross-functional action items
- Lead regular technical and program reviews with customers and internal teams
Cross-functional Integration (Core Responsibility)
- Act as the central coordination point across:
- Customer engineering teams
- Package Design Engineering
- ADK / Enablement teams
- Process, manufacturing, and OSAT partners
- Translate Rapidus technology updates into clear, actionable guidance for customers
- Ensure alignment between design assumptions and manufacturing capabilities
Technical Issue Resolution
- Support debugging and issue resolution in areas such as:
- SI/PI and signal integrity challenges
- Package layout and routing issues
- ADK usage and interpretation
- Drive root-cause analysis and coordinate solution deployment across teams
Continuous Improvement & Ecosystem Feedback
- Capture customer feedback and drive improvements in:
- ADK quality and usability
- Design methodologies and flows
- Documentation and training materials
- Contribute to strengthening the chiplet ecosystem and customer readiness
Required Qualifications
- B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
- 5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles
- Strong understanding of:
- 2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)
- High-speed interfaces (HBM, PCIe, UCIe, SerDes)
- Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
- Proven ability to manage complex technical programs and cross-functional activities
- Strong communication skills with customer-facing experience
Preferred Qualifications
- Experience in foundry, OSAT, or semiconductor customer support roles
- Familiarity with ADK / PDK and design enablement flows
- Experience with die-package-system co-design methodologies
- Background in HPC, AI, or networking systems
- Experience in silicon bring-up, validation, or failure analysis
- Knowledge of advanced substrates (ABF, glass core, fan-out RDL)
- Japanese language skills for collaboration with Japan-based customers
What You Will Impact
- Ensure successful customer design execution and tape-out delivery
- Bridge the gap between ADK (Assembly Design Kit: design environment) and real product realization
- Integrate design, technology, and execution into a coherent development flow
- Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond
What We Offer
- Opportunity to play a critical role in customer success for next-generation chiplet platforms
- Work at the intersection of technology, execution, and system integration
- Collaboration with global teams across the US and Japan
- Competitive compensation and career growth opportunities
Benefits
- Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles)
- 401k with no employer match