Principal Packaging & Device Assembly Engineer
WHO?
INCOG Biopharma Services in Indianapolis, IN is looking for a Principal Packaging & Device Assembly Engineer who will be working closely within the TSMS (Technical Services & Manufacturing Sciences) team. This individual will be responsible for providing strategic leadership for device assembly and packaging development across all facets of Tech transfer, Process Validation, GMP Floor Support, and Continued Process Verification. This role offers the opportunity to work at INCOG’s state-of-art CDMO during an exciting time of growth, contributing towards a better path to market for life-saving drugs.
WHAT?
This is a crucial role within the TSMS team, and the successful individual will be responsible for driving strategic delivery of technical guidance and leadership throughout the most complex packaging and device assembly processes.
YOU!
Ideally, candidates will have a Bachelor’s and Master’s degree in Science, Engineering, or Packaging Technology, along with 6-8 years of experience in pharmaceutical packaging or combination product development and commercialization.
WHY INCOG?
Don’t meet all the requirements? Don’t sweat! We’re always looking for an excuse to discuss your next opportunity. You might just surprise yourself…
Lead Candidate wholeheartedly supports Equality and Diversity in employment and opposes all forms of unlawful or unfair discrimination on the grounds of age, disability, sex, gender reassignment, sexual orientation, pregnancy and maternity, race, religion or belief and marriage and civil partnerships.