The Director of Probe & Post‑Fab Operations is responsible for end‑to‑end leadership of wafer manufacturing activities from electrical probe through post‑fab processing, including wafer thinning and back side metallization. This role owns the transition from electrical qualification to wafer readiness for assembly, with accountability for yield, cost per wafer, wafer integrity, reliability, cycle time, and operational scalability.
A key responsibility of this role is to define and execute the automation strategy for Post‑Fab Operations, ensuring that post‑fab manufacturing systems, controls, and data integration resemble front‑end fab standards, while supporting a phased approach to material handling automation (onsemi assembly test operations and external assembly)
Leadership & Strategy
- Define and execute the operational, technical, and automation strategy for Probe & Post‑Fab Operations
- Establish a phased automation roadmap for Post‑Fab, balancing near‑term practicality with long‑term scalability
- Ensure Post‑Fab systems and execution models align with fab‑level manufacturing standards
Operational Ownership
- Full accountability for yield, cost per wafer, cycle time, and quality from probe through post‑fab
- Lead stable execution of post‑fab operations during automation transitions
- Drive continuous improvement while maintaining production continuity
Automation & Manufacturing Systems
- Lead the evolution of Post‑Fab Operations toward a fab‑like operating model, including:
- MES usage, tracking, and lot genealogy
- SPC, recipe control, and data integrity
- Standard work and operational discipline
- Establish an automation approach where:
- Short‑term: tool‑to‑tool transport may remain manual
- Long‑term: material delivery and flow enable automated solutions
- Partner with IT, Manufacturing Systems, and Facilities to ensure scalable, standardized implementation
Technical Stewardship
- Provide oversight of:
- Probe strategies and probe card utilization
- Wafer thickness targets, TTV, warp, and bow controls
- Back side metallization robustness and compatibility with assembly flows
- Ensure manufacturing readiness for new products and volume ramps
Organization & Talent
- Build, develop, and retain high‑performing engineering and operations teams
- Establish clear expectations for managers and technical leaders
- Promote a culture of discipline, accountability, and continuous improvement
Cross‑Functional Integration
- Serve as the primary interface to:
- Front‑end Fab leadership
- Assembly and packaging organizations
- Quality, reliability, supply chain, and IT teams
- Support capital planning, automation investments, and cost‑reduction initiatives
- Probe Strategy & Electrical Test Oversight
- Automation Strategy & Deployment
- Backside Metallization & Assembly Readiness
- Semiconductor Manufacturing Operations (Probe & Post Fab)
- Talent Development & Org Leadership
- Wafer Thinning & Backend Process Control
- strategic leadership and change management
