Description
• Lead formulation and optimization of polymer-based thermal interface materials(TIM1, TIM1.5, TIM2) and potting compounds for advanced semiconductorpackaging.• Apply structure–property relationships to guide formulation strategy, performancetrade-offs, and portfolio evolution.• Design and execute hypothesis-driven experimental programs linking polymerchemistry, fillers, and processing to thermal, mechanical, and reliabilityperformance.• Generate high-quality data to support stage-gate decisions, technical riskassessment, and commercializationBuild and evaluate package-level assemblies to assess material performance underrealistic thermal, mechanical, and environmental conditions.• Support reliability testing and qualification for high thermal flux and mechanicallyconstrained packaging environments.• Translate material-level results into package- and system-level performanceimplications.Customer & Market Engagement• Lead customer-facing technical engagement for thermal interface and pottingmaterials in advanced semiconductor packaging.• Translate customer requirements into R&D priorities while maintaining a focus ontechnology leadership.• Partner with hyperscalers and contract manufacturers to accelerate adoption ofnext-generation thermal solutions in AI and data center applications.Cross-Functional Collaboration• Partner with Product Development, Manufacturing, and Marketing to ensureformulations are scalable, manufacturable, and aligned with portfolio strategy.• Support portfolio validation by providing data, samples, and technicaldocumentation to enable design-in and qualification.
Additional Skills & Qualifications
7+ years of industry experience developing, formulating, or validating polymerbasedmaterials for semiconductor packaging, electronics assembly, thermalinterface materials, or other high-reliability applications.• Strong applied understanding of polymer chemistry, composite formulation, andadditive systems, with the ability to link formulation design to thermomechanicalperformance.• Experience applying structure–property relationships to manage performancetrade-offs across TIM1, TIM1.5, TIM2, and potting compound applications.Job Title: R&D Manager - Thermal SolutionsReports to: VP Marketing & Product DevelopmentLocation: Westwood, MA• Working knowledge of PCB- and advanced-package-level thermal and mechanicalenvironments, including processor packaging, lids/stiffeners, cold plates, and TIMselection and reliability considerations.Education• Bachelor’s degree in Materials Science, Polymer Science, Chemical Engineering,Electrical Engineering, or a related discipline. Advanced degrees preferred.
Experience Level
Expert Level
This is a Permanent position based out of Westwood, MA.
Pay and BenefitsThe pay range for this position is $150000.00 - $160000.00/yr.
Health, Vision, Dental, 401K
Workplace TypeThis is a fully onsite position in Westwood,MA.
Application DeadlineThis position is anticipated to close on Apr 17, 2026.
Diversity, Equity & Inclusion
At Actalent, diversity and inclusion are a bridge towards the equity and success of our people. DE&I is embedded into our culture through:
Actalent is an equal opportunity employer.
About Actalent
Actalent is a global leader in engineering and sciences services. For more than 40 years, we’ve helped visionary companies advance their goals. Headquartered in the United States, our teams span 150 offices across North America, EMEA, and APAC—with four delivery centers in India led by 1,000+ extraordinary employees who connect their passion with purpose every day.
Our Bangalore, Hyderabad, Pune, and Chennai delivery centers are hubs of engineering expertise, with core capabilities in mechanical and electrical engineering, systems and software, and manufacturing engineering. Our teams deliver work across multiple industries including transportation, consumer and industrial products, and life sciences. We serve more than 4,500 clients, including many Fortune 500 brands. Learn more about how we can work together at actalentservices.com.