Principal Packaging Engineer

Principal Substrate and Packaging Engineer

Fully onsite in the San Francisco Bay Area

Full time opportunity

$400-500K total compensation package- base, bonus, stock (depends on skillset/experience level)

Industry leader in semiconductor design focused on advanced IC packaging and high‑speed interconnect technologies. In the role, you will have primarily be responsible for the layout, routing, and functionality of packages and substrates, including design of high-speed lines.

What You’ll Do

• Design and layout advanced IC packages, substrates, and interposers, including high‑speed signal routing
• Collaborate closely with electrical, mechanical, SI/PI, and program teams during front‑end and detailed layout
• Define layout rules, panelization strategies, and stack‑ups with substrate and package vendors
• Perform peer design reviews and contribute to layout best practices and flow improvements
• Execute DRC and LVS checks to ensure layout correctness
• Support post‑fab evaluation, including visual inspection, electrical validation, and high‑speed characterization
• Develop and apply script‑based layout automation to improve efficiency and quality
• Simulate layouts and recommend design optimizations to meet performance and reliability targets

Required Background

• BS/MS/PhD in Electrical, Computer, Mechanical Engineering, or related field
• 10+ years of hands‑on experience in IC substrate and package layout
• Deep expertise with EDA layout tools, such as: Calibre/Klayout, Cadence Allegro Package Designer, Innovus and Virtuoso
• Multilayer and high‑speed layout
• RF design fundamentals
• Package/substrate manufacturing processes and materials
• Surface‑mount technology (SMT)