Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred.
Knowledge of packaging material property and behavior is beneficial.
Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.
Minimum educational qualification is an AS degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development.
